videobox developer manual

software components

source code

• https://git.fosdem.org/video

• See the links in the diagram above for specific components.

ms213x documentation

ms2131s

Sources

• Macrosilicon product page

• UltraSemi product page

General Description

MS2131S is a USB 3.0 HD video and audio acquisition and processing chip, which integrates a USB 3.0 device controller, data transceiver module, and audio/video processing module. MS2131S can transmit the HD input audio and video signals to a PC, smartphone, or tablet for preview or acquisition through the USB 3.0 interface. MS2131S supports HD loop out. MS2131S supports 3 channels of I2S input, supports mixing of digital audio with HD audio, supports 3 channels of I2S output, and supports S/PDIF output. MS2131S output supports YUV422, MJPEG, RGB24 and NV12 modes, and is compatible with Windows, Android and macOS systems. MS2131S has a built-in MCU, supporting function customization and secondary development.

Features

HD RX

• Supports RGB444, YCBCR422, YCBCR444, YCBCR420 color space

• Supports deep color 24/30/36 bit mode

• Supports CEA-861-E, CEA-861-F video formats

• Max input resolution:

  • 4096×2160@60Hz YUV420

  • 4096×2160@30Hz YUV444

• Supports HDCP 1.4

HD TX

• Supports EDID/HPD processing

• Max output resolution:

  • 4096×2160@60Hz (YUV420)

  • 4096×2160@30Hz (YUV444)

• Supports HD RX to HD TX pass-through mode output

Audio

• USB audio default 48kHz/24bit stereo output

• USB audio supports 5.1 channel mode

• Supports HD RX 5.1/7.1 channel audio capture

• Supports 3 channels of I2S input

• Supports 3 channels of I2S output and 1 channel of S/PDIF output

• Supports mixing processing of any 2 I2S input channels and HD audio

USB 3.0

• Integrated USB 3.0 device, compatible with USB 2.0 device mode

• USB video conforms to UVC1.0 specification

• USB audio conforms to UAC1.0 specification

• USB video output supports YUV422, MJPEG, RGB24 and NV12 modes

• USB video output max resolution:

  • 4096×2160@60Hz (MJPEG)

  • 3840×2160@30Hz (YUV420)

OS Support

• Windows XP/7/8/10/11

• Android 5.0 or higher

• Linux

• macOS

Clock

• External 24MHz passive crystal oscillator

• On-chip PLL

Reset

• On-chip power-on reset circuit

Package

• LQFP-100 plastic (14mm×14mm)

• RoHS compliant

Applications

• High Definition Video Capture Card

• Security and Protection Monitoring

• Medical Imaging

• Live Network Streaming

Function Block Diagram

Function Description

GPIO

MS2131S has 10 programmable GPIOs, which can be customized by software.

Audio Mixing Function

MS2131S supports 3 channels of I2S input, HD RX audio processing, 3 channels of I2S output, and 1 channel of S/PDIF audio output, which can realize various mixing processing through software configuration to meet the requirements of different application scenarios.

The audio mixing function application block diagram is shown below. For specific applications, please refer to the SDK User Guide.

HD Loop Out Function

MS2131S supports USB acquisition of the HD input audio/video data source, and also supports HD video signal loop-out. HD RX supports HPD processing and EDID customization.

USB Video Output

MS2131S supports USB3.0 and USB2.0 mode video capture, USB video conforms to the UVC1.0 specification, and supports YUV422, MJPEG, RGB24 and NV12 format video output, with a default max output resolution of 4096×2160@60Hz (MJPEG).

The MS2131S USB default output resolution list is as follows. The output resolution can be customized by the user by modifying the software configuration.

Default output resolutions

USB 3.0 Mode:

YUV422:	MJPEG:
4096×2160@25Hz/20Hz/15Hz/10Hz/5Hz	4096×2160@60Hz/50Hz/30Hz/20Hz/10Hz
2560×1440@50Hz/30Hz/20Hz/15Hz/10Hz	2560×1440@60Hz/50Hz/30Hz/20Hz/10Hz
3840×2160@25Hz/20Hz/15Hz/10Hz/5Hz	3840×2160@60Hz/50Hz/30Hz/20Hz/10Hz
1920×1080@60Hz/50Hz/30Hz/20Hz/10Hz	1920×1080@120Hz/60Hz/50Hz/30Hz/20Hz/10Hz
1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz	1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz
1360×768@60Hz/50Hz/30Hz/20Hz/10Hz	1360×768@60Hz/50Hz/30Hz/20Hz/10Hz
1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz	1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz
1280×960@60Hz/50Hz/30Hz/20Hz/10Hz	1280×960@60Hz/50Hz/30Hz/20Hz/10Hz/6Hz
1280×720@60Hz/50Hz/30Hz/20Hz/10Hz	1280×720@60Hz/50Hz/30Hz/20Hz/10Hz
1024×768@60Hz/50Hz/30Hz/20Hz/10Hz	1024×768@60Hz/50Hz/30Hz/20Hz/10Hz
800×600@60Hz/50Hz/30Hz/20Hz/10Hz	800×600@60Hz/50Hz/30Hz/20Hz/10Hz
RGB24:	NV12:
1920×1080@60Hz/30Hz/25Hz/20Hz/10Hz	3840×2160@30Hz/20Hz/10Hz
1280×720@60Hz/50Hz/30Hz/20Hz/10Hz	2560×1440@60Hz/30Hz/20Hz/10Hz
800×600@60Hz/50Hz/30Hz/20Hz/10Hz	1920×1080@60Hz/30Hz/20Hz/10Hz/6Hz
	1280×720@60Hz/50Hz/30Hz/20Hz/10Hz

USB 2.0 Mode:

YUV422:	MJPEG:
1920×1080@10Hz/5Hz	1920×1080@50Hz/30Hz/25Hz/20Hz/10Hz
1600×1200@10Hz/5Hz	1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz
1360×768@15Hz/8Hz	1360×768@60Hz/50Hz/30Hz/20Hz/10Hz
1280×1024@15Hz/8Hz	1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz
1280×960@15Hz/8Hz	1280×960@60Hz/50Hz/30Hz/20Hz/10Hz
1280×720@20Hz/10Hz	1280×720@60Hz/50Hz/30Hz/20Hz/10Hz
1024×768@20Hz/10Hz	1024×768@60Hz/50Hz/30Hz/20Hz/10Hz
800×600@30Hz/20Hz/10Hz	800×600@60Hz/50Hz/30Hz/20Hz/10Hz
720×576@50Hz/25Hz/20Hz/10Hz	720×576@60Hz/50Hz/30Hz/20Hz/10Hz
720×480@60Hz/30Hz/20Hz/10Hz	720×480@60Hz/50Hz/30Hz/20Hz/10Hz
640×480@60Hz/30Hz/20Hz/10Hz	640×480@60Hz/50Hz/30Hz/20Hz/10Hz
NV12:
1920×1080@15Hz/10Hz/5Hz
1280×720@30Hz/25Hz/20Hz/10Hz/5Hz
800×600@60Hz/30Hz/20Hz/10Hz

USB Audio Output

MS2131S USB audio conforms to the UAC1.0 specification, and the default output is 48kHz/24bit stereo. Audio output at other sample rates can be achieved through software configuration.

PIN Map

PIN Description

Pin Name	Pin #	Type	Description
General IO
GPIO0/I2SIN_SD2/PWM0	76	DIO	General purpose digital IO; multiplexed as the 2nd I2S data input; multiplexed as PWM0 output
GPIO1/I2SOUT_SD2/PWM1	77	DIO	General purpose digital IO; multiplexed as the 2nd I2S data output; multiplexed as PWM1 output
GPIO2/SPICS/URTX	60	DIO	General purpose digital IO, multiplexed with the SPI Master interface CS pin and UART TX pin. If an SPI flash is connected on the board, the chip is automatically configured for SPICS function after power-on
GPIO3/SPISCLK/URRX/SDA	58	DIO	General purpose digital IO, multiplexed with the SPI Master interface SCLK pin, UART RX pin, and I2C Master SDA pin. If an SPI flash is connected on the board, the chip is automatically configured for SPISCLK function after power-on
GPIO4/SPIMOSI/SCL	57	DIO	General purpose digital IO, multiplexed with the SPI Master interface MOSI pin and I2C Master SCL pin. If an SPI flash is connected on the board, the chip is automatically configured for SPIMOSI function after power-on
GPIO5/SPIMISO	59	DIO	General purpose digital IO, multiplexed with the SPI Master interface MISO pin. If an SPI flash is connected on the board, the chip is automatically configured for SPIMISO function after power-on
GPIO6	22	DIO	General purpose digital IO
GPIO7	23	DIO	General purpose digital IO
GPIO13	99	DIO	General purpose digital IO
GPIO14/PWM2	56	DIO	General purpose digital IO; multiplexed as PWM2 output
USB
DP	7	DIO	USB 2.0 differential positive signal
DM	5	DIO	USB 2.0 differential negative signal
USB_REXT	10	AO	Connect a 200Ω resistor to ground
SSTXP	15	DO	USB 3.0 differential output positive signal
SSTXM	13	DO	USB 3.0 differential output negative signal
SSRXP	19	DI	USB 3.0 differential input positive signal
SSRXM	17	DI	USB 3.0 differential input negative signal
HD RX
HD RXCN	81	DI	HD RX differential clock input negative signal
HD RXCP	82	DI	HD RX differential clock input positive signal
HD RX0N	87	DI	HD RX differential channel 0 data input negative signal
HD RX0P	88	DI	HD RX differential channel 0 data input positive signal
HD RX1N	91	DI	HD RX differential channel 1 data input negative signal
HD RX1P	92	DI	HD RX differential channel 1 data input positive signal
HD RX2N	96	DI	HD RX differential channel 2 data input negative signal
HD RX2P	97	DI	HD RX differential channel 2 data input positive signal
HD RX_REXT	79	AO	Connect a 1.6kΩ resistor to ground
HD RXHPD	49	DO (5V tolerant)	HD RX hot-plug detect signal output
HD RXDET	47	DI (5V tolerant)	HD RX 5V input detection
RXDDCSDA	48	DIO (5V tolerant)	HD RX display data channel serial data bus
RXDDCSCL	46	DI (5V tolerant)	HD RX display data channel serial clock bus
HD TX
HD TXCN	33	DO	HD TX differential clock output negative signal
HD TXCP	34	DO	HD TX differential clock output positive signal
HD TX0N	35	DO	HD TX differential channel 0 data output negative signal
HD TX0P	36	DO	HD TX differential channel 0 data output positive signal
HD TX1N	37	DO	HD TX differential channel 1 data output negative signal
HD TX1P	38	DO	HD TX differential channel 1 data output positive signal
HD TX2N	39	DO	HD TX differential channel 2 data output negative signal
HD TX2P	40	DO	HD TX differential channel 2 data output positive signal
HD TX_REXT	44	AO	Connect a 1.6kΩ resistor to ground
HD TXHPD	45	DI (5V tolerant)	HD TX hot-plug detect signal input
TXDDCSDA	53	DIO (5V tolerant)	HD TX display data channel serial data bus
TXDDCSCL	52	DO (5V tolerant)	HD TX display data channel serial clock bus
Digital Audio
I2SIN_WS	63	DIO	I2SIN_WS signal, output in master mode by default; can be configured by software to work in slave mode
I2SIN_SCLK	64	DIO	I2SIN_SCLK signal, output in master mode by default; can be configured by software to work in slave mode
I2SIN_SD0	65	DI	1st I2S data input
I2SIN_SD1	62	DI	2nd I2S data input
I2S_MCLKOUT	66	DO	Provides a 12.288MHz clock output
I2SOUT_WS	69	DO	I2SOUT_WS signal, output in master mode by default
I2SOUT_SCLK	70	DO	I2SOUT_SCLK signal, output in master mode by default
I2SOUT_SD0	72	DO	1st I2S data output
I2SOUT_SD1	71	DO	2nd I2S data output
SPDIFOUT	73	DO	S/PDIF format audio output
Debug PIN
MCU_SEL	78	DI	Debug pin, pulled up by default
Crystal
XTIN	28	AI	24MHz passive crystal oscillator input
XTOUT	29	AO	24MHz passive crystal oscillator output
System Power & Ground
AVDD33_USB1~3	3,8,11	P	USB module 3.3V supply
AVDD33_1~4	80,86,90,95	P	Analog 3.3V supply
DVDD33_1~7	2,20,51,55,61,74,100	P	Digital IO 3.3V supply
AVDD25_1~4	27,30,43,83	P	Analog 2.5V supply
AVDD11_USB1~3	9,14,18	P	USB module low-voltage supply, 1.15V
DVDD11_1~2	25,67	P	Digital low-voltage supply, 1.15V
AVDD11_1~5	31,42,85,89,94	P	Analog low-voltage supply, 1.15V
AVSS_1~10	4,6,12,16,26,32,41,84,93,98	G	Analog ground
DVSS_1~7	1,21,24,50,54,68,75	G	Digital ground

Abbreviation	Description
AI	Analog Input
AO	Analog Output
DI	Digital Input
DO	Digital Output
DIO	Digital Bi-direction
P	Power
G	Ground

Note: the recommended supply voltage for AVDD11/DVDD11 is 1.15V.

Electrical Characteristics

Absolute Maximum Ratings

Parameter	Symbol	Value	Unit
Maximum Operating Voltage (AVDD33/DVDD33)	VDD33	3.63	V
Maximum Operating Voltage (AVDD25)	VDD25	2.75	V
Maximum Operating Voltage (AVDD11/DVDD11)	VDD11	1.21	V
Ambient Operating Temperature	TA	0 to 70	°C
Storage Temperature	Tsto	-65 to +150	°C
Allowable Junction Temperature	Tjmax	125	°C

Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other condition beyond that indicated in this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameter	Symbol	Value	Unit
Human Body Model (HBM)	VESD(HBM)	±2000	V
Machine Model (MM)	VESD(MM)	±100	V
Charged Device Model (CDM)	VESD(CDM)	±500	V

ESD protection note: static charge can accumulate on the human body and on test equipment and discharge without being detected. Although this product incorporates ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. It is recommended that proper ESD precautions be taken to avoid any degradation in performance or loss of functionality.

Parameter	Symbol	Value	Unit
Junction-to-ambient Thermal Resistance (JEDEC 4-layer test board)	RθJA	30	°C/W
Junction-to-board Thermal Resistance	RθJB	8	°C/W
Junction-to-case Thermal Resistance	RθJC	12	°C/W

DC Characteristics

Parameter	Condition	MIN	Typical	MAX	Unit	Test Condition
VDD33		3.135	3.3	3.465	V	GND = 0V, T = +25°C unless otherwise noted
VDD25		2.375	2.5	2.625	V	GND = 0V, T = +25°C unless otherwise noted
VDD11		1.1	1.15	1.2	V	GND = 0V, T = +25°C unless otherwise noted
Input Low Voltage (normal IO)		-0.3		0.8	V
Input High Voltage (normal IO)		2.0		3.6	V
Output Low Voltage (normal IO)	VDD=3.3V, IOL=31.5mA			0.4	V
Output High Voltage (normal IO)	VDD=3.3V, IOH=54.3mA	2.4			V
Input Low Voltage (5V-tolerant IO)		-0.3		0.8	V
Input High Voltage (5V-tolerant IO)		2.0		5.5	V
Output Low Voltage (5V-tolerant IO)	VDD=3.3V, IOL=14.3mA			0.4	V
Output High Voltage (5V-tolerant IO)	VDD=3.3V, IOH=17.6mA	2.4			V

Note: VDD33 includes AVDD33_USB, DVDD33, AVDD33. VDD11 includes AVDD11_USB, DVDD11, AVDD11.

Normal IO pins: GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO13, GPIO14, MCU_SEL, I2SIN_WS, I2SIN_SD0, I2SIN_SD1, I2SIN_SCLK, I2SOUT_WS, I2SOUT_SD0, I2SOUT_SD1, I2SOUT_SCLK, I2S_MCLKOUT.

5V-tolerant IO pins: HD RXHPD, HD RXDET, RXDDCSDA, RXDDCSCL, HD TXHPD, TXDDCSDA, TXDDCSCL.

Power-On Sequence Requirements

MS2131S must power up with AVDD25 first, followed by DVDD33, AVDD33, AVDD11 and DVDD11; there is no ordering requirement among DVDD33, AVDD33, AVDD11 and DVDD11.

Note:

• T1 recommended range: 10us~100ms

• T2 recommended range: 0us~100ms

• T3 recommended range: 10us~100ms

• AVDD25 must power up before the other supplies; there is no ordering requirement between DVDD33, AVDD33 and AVDD11/DVDD11.

Power Consumption in Different Modes

Test condition: GND = 0V, T = +25°C.

Operating Mode	Power/W
UVC ON, input 4096×2160@60Hz YUV420, output MJPEG 4096×2160@60Hz	0.91
UVC OFF, HD not connected	0.25
USB Suspend	0.14

USB input fixed at 4096×2160@60Hz (YUV420), HD loop out; typical current values in different resolution modes.

Test condition: GND = 0V, T = +25°C.

Parameter	MJPEG 4096×2160@60Hz output	MJPEG 1920×1080@60Hz output	MJPEG 1280×720@60Hz output	Unit
AVDD33	90	90	90	mA
DVDD33	25	20	20	mA
AVDD25	60	60	60	mA
AVDD11	115	115	115	mA
DVDD11	250	120	140	mA

Typical Application Circuit

Notes from the reference schematic:

• The power supply of DVDD11/AVDD11 is 1.15V. To reduce ripple, increase the capacitance; the recommended capacitance is 22uF.

• R1 must be close to pin 79 (HD RX_REXT).

• R2 must be close to pin 10 (USB_REXT).

• R4 must be close to pin 44 (HD TX_REXT).

PCB Design Guidelines

Power and Ground

Power trace width should correspond to the current flowing through it. Refer to the current values in the Electrical Characteristics section. When laying out the PCB, power and ground traces should be as wide as possible.

The decoupling capacitors for chip power supply need to be placed close to the chip’s power pins. Power should flow through the decoupling capacitor before entering the chip’s power pin, and the decoupling capacitor’s ground should be connected to the power ground plane through a nearby via.

Clock

Place the crystal oscillator close to the chip, and keep the routing as short as possible. A ground pour around the crystal is required. No traces should be routed on the layer below the crystal, to keep a complete ground plane.

REXT Reference Resistor

1. USB_REXT: connect a 200Ω resistor to ground, placed close to pin 10.

2. HD RX_REXT: connect a 1.6kΩ resistor to ground, placed close to pin 79.

3. HD TX_REXT: connect a 1.6kΩ resistor to ground, placed close to pin 44.

USB Signal Lines

The SSTXP/M, SSRXP/M and DP/M differential pairs require impedance matching of 90Ω±10%. Keep the differential pair routing as short as possible, with no more than one via pair; the intra-pair length mismatch should be within 5mil, and the total length should not exceed 2000mil. A ground pour is required around the differential pairs; keep other signal traces at least 3x the trace width away (3W rule). No traces should be routed on the layer below, to keep a complete ground plane.

HD Signal Lines

1. Route as differential pairs, with an impedance requirement of 100Ω±10%.

2. Keep the differential pair routing as short as possible. The 4 differential pairs should be length- and spacing-matched, with intra-pair length mismatch within 5mil.

3. No other signal traces or components should be routed or placed on the reverse side of the differential pairs, to keep the reference ground plane behind the differential pairs intact.

4. Each differential pair should not change layers through more than 2 vias; when changing layers, ensure that all lines within a group stay on the same layer.

5. ESD devices and series resistors should be placed close to the HD connector, in the order: HD connector → resistor → ESD device.

Package Outline

Top Mark

Packing Information

Packing Information

	Packing carton dimension (Unit: mm)
Inner Carton	370(L)×155(W)×85(H)
Outer Carton	390(L)×330(W)×280(H)

Package Outline	Quantity per TRAY (Unit: PCS)	Quantity per inner carton (Unit: PCS)	Quantity per outer carton (Unit: PCS)	Inner Carton : Outer Carton
LQFP100 (14×14)	90	900	5400	6:1

Carrier Tray Dimension

Reflow Specifications

Reflow Profile	Pb-Free Assembly
Preheating time (Tsmin to Tsmax)	60~120 seconds (150~200°C)
Liquidous Temperature (TL)	217°C
Peak Temperature (TP)	260°C (+5/-0°C)
Ramp-up Rate (TL to TP)	≤ 3.0°C/second
Time Maintained above TL	60~150 seconds
Time Within 5°C of Peak Temperature (above 255°C)	30~40 seconds
Ramp-up Rate (TP to TL)	≤ 6.0°C/second
Time 25°C to Peak Temperature	≤ 8 minutes

ms2131

Sources

• Macrosilicon product page

• Datasheet at LCSC

• Link-ker design files

General Description

MS2131 is a USB 3.0 HD video and audio acquisition and processing chip, which integrates USB 3.0 device controller, data transceiver module, audio and video processing module. MS2131 can transmit the HDMI input audio and video signals to PC, smartphone and tablet for preview or acquisition through USB 3.0 interface, and can also display or expand the information on PC, smartphone and tablet to larger display devices through USB 3.0 interface. MS2131 supports HDMI loop out function, supports USB Host recording while playing audio and video through HDMI output. MS2131 supports 2 channels digital audio (I2S) input, and supports digital audio and HDMI audio mixing process. MS2131 supports 2 channels digital audio (I2S) output and SPDIF digital audio output. MS2131 output supports YUV422 and MJPEG modes, compatible with Windows, Android and Mac OS systems.

Features

HDMI RX

• HDMI 1.4b compatible

• Supports DVI 1.0

• Supports HDCP 1.4

• Supports RGB444, YCBCR422, YCBCR444, YCBCR420 color space

• Supports deep color 24/30/36 bit mode

• Supports CEA-861-E/CEA-861-F video format

• Max input resolution: 4K(3840×2160@30Hz)

HDMI TX

• HDMI 1.4b compatible

• Supports EDID / HPD process

• Supports DVI 1.0 mode

• Max output resolution: 4K(3840×2160@30Hz)

• Supports HDMI RX to HDMI TX pass-through mode output

Audio

• USB audio default 48KHz stereo output

• Supports 2 channels digital audio (I2S) input

• Supports 2 channels of digital audio I2S, 1 channel of SPDIF output

• Supports 2 channels I2S input audio and HDMI audio mixing processing

USB 3.0

• Integrated USB 3.0 device

• Compatible with USB 2.0 device mode

• USB video conforms to UVC1.0 specification

• USB audio conforms to UAC1.0 specification

• USB video output supports both YUV422 and MJPEG modes

• USB video output resolution:

  • Default max resolution 1920×1080@60Hz

OS Support

• Windows XP/7/8/10/11

• Android 5.0 or higher

• Linux

• Mac OS

Clock

• External 24MHz passive crystal oscillator

• On-chip PLL

Reset

• On-chip power on reset

Package

• LQFP-100 plastic(14mm×14mm)

• RoHS compliant

Applications

• High Definition Video Capture Card

• Security and Protection monitoring

• Medical Image

• Live Video Streaming

Function Block Diagram

Function Description

GPIO

MS2131 has eight programmable GPIOs, which can be customized by software.

Audio Mixing Function

MS2131 supports 2 channels digital audio (I2S) input, HDMI RX audio processing, 2 channels digital audio (I2S) output, one SPDIF audio output, which can realize various mixing processing through software configuration to meet the application of different scenarios.

The audio mixing function application block diagram is shown in the figure below. For specific applications, please refer to the SDK User Guide.

HDMI Loop Out Function

MS2131 supports USB to collect HDMI input audio and video data sources, and also supports HDMI video signal loop-out function. Supports HDCP & HPD processing, and EDID customization.

Item	Description
Display Product Name	HDMI TO USB
Best resolution 1	1080P@60Hz, 148.5MHz
Video support resolution list	640×480@60Hz 800×600@60Hz 1024×768@60Hz 1152×864@60Hz 1280×720@60Hz 1280×800@60Hz 1280×960@60Hz 1280×1024@60Hz 1440×900@60Hz 1600×900@60Hz 1680×1050@60Hz 1920×1080@60Hz 3840×2160@30Hz 3840×2160@50Hz 3840×2160@60Hz 4096×2160@30Hz 4096×2160@50Hz 4096×2160@60Hz
Color space support	RGB, YUV444, YUV422, YUV420
Deep color support	30bits, 36bits
Audio format support	Format: L-PCM Sampling rate: 32kHz, 44.1KHz, 48Khz Number of channels: maximum two channels Bit width: 16bit, 20bit, 24bit

USB Video Output

MS2131 supports USB3.0 & USB2.0 mode video capture, and USB video conforms to UVC1.0 specification, supports YUV422 and MJPEG format video output and the default maximum output resolution 1920×1080@60Hz.

The MS2131 USB default output resolution list is as follows. The output resolution can be customized by the user by modifying the software configuration (support up to 4K@15Hz).

USB 3.0 Mode:

YUV422：	MJPEG：
1920×1080@60Hz/50Hz/30Hz/20Hz/10Hz	1920×1080@60Hz/50Hz/30Hz/20Hz/10Hz
1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz	1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz
1360×768@60Hz/50Hz/30Hz/20Hz/10Hz	1360×768@60Hz/50Hz/30Hz/20Hz/10Hz
1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz	1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz
1280×960@/60Hz/50Hz/30Hz/20Hz/10Hz	1280×960@/60Hz/50Hz/30Hz/20Hz/10Hz
1280×720@60Hz/50Hz/30Hz/20Hz/10Hz	1280×720@60Hz/50Hz/30Hz/20Hz/10Hz
1024×768@60Hz/50Hz/30Hz/20Hz/10Hz	1024×768@60Hz/50Hz/30Hz/20Hz/10Hz
800×600@60Hz/50Hz/30Hz/20Hz/10Hz	800×600@60Hz/50Hz/30Hz/20Hz/10Hz
720×576@60Hz/50Hz/30Hz/20Hz/10Hz	720×576@60Hz/50Hz/30Hz/20Hz/10Hz
720×480@60Hz/50Hz/30Hz/20Hz/10Hz	720×480@60Hz/50Hz/30Hz/20Hz/10Hz
640×480@60Hz/50Hz/30Hz/20Hz/10Hz	640×480@60Hz/50Hz/30Hz/20Hz/10Hz

USB 2.0 Mode:

YUV422：	MJPEG：
1920×1080@10Hz/5Hz	1920×1080@50Hz/30Hz/25Hz/20Hz/10Hz
1600×1200@10Hz/5Hz	1600×1200@60Hz/50Hz/30Hz/20Hz/10Hz
1360×768@15Hz/8Hz	1360×768@60Hz/50Hz/30Hz/20Hz/10Hz
1280×1024@15Hz/8Hz	1280×1024@60Hz/50Hz/30Hz/20Hz/10Hz
1280×960@15Hz/8Hz	1280×960@/60Hz/50Hz/30Hz/20Hz/10Hz
1280×720@20Hz/10Hz	1280×720@60Hz/50Hz/30Hz/20Hz/10Hz
1024×768@20Hz/10Hz	1024×768@60Hz/50Hz/30Hz/20Hz/10Hz
800×600@30Hz/20Hz/10Hz	800×600@60Hz/50Hz/30Hz/20Hz/10Hz
720×576@50Hz/25Hz/20Hz/10Hz	720×576@60Hz/50Hz/30Hz/20Hz/10Hz
720×480@60Hz/30Hz/20Hz/10Hz	720×480@60Hz/50Hz/30Hz/20Hz/10Hz
640×480@60Hz/30Hz/20Hz/10Hz	640×480@60Hz/50Hz/30Hz/20Hz/10Hz

USB Audio Output

MS2131 USB audio conforms to UAC1.0 specification, and the default output is 48KHz stereo. The audio output of other resolutions can be realized through software configuration.

PIN Map

PIN Description

Pin Name	Pin #	Type	Description
GPIO
GPIO0	76	DIO	General purpose digital IO
GPIO1	77	DIO	General purpose digital IO
GPIO2/SPICS/URTX	60	DIO	General purpose digital IO, multiplexed with SPI Master interface CS pin and UART TX pin. If SPI interface flash is connected to the periphery, the chip will be automatically configured as SPICS function after power on
GPIO3/SPISCLK/URRX/SDA	58	DIO	General purpose digital IO, multiplexed with SPI Master interface SCLK pin, UART RX pin and I2C Master SDA pin. If SPI interface flash is connected to the periphery, the chip will be automatically configured as SPISCLK function after power on
GPIO4/SPIMOSI/SCL	57	DIO	General purpose digital IO, multiplexed with SPI Master interface MOSI pin and I2C Master SCL pin. If SPI interface flash is connected to the periphery, the chip will be automatically configured as SPIMOSI function after power on
GPIO5/SPIMISO	59	DIO	General purpose digital IO, multiplexed with SPI Master interface MISO pin. If SPI interface flash is connected to the periphery, the chip will be automatically configured as SPIMISO function after power on
GPIO6	22	DIO	General purpose digital IO
GPIO7	23	DIO	General purpose digital IO
USB
DP	7	DIO	USB 2.0 differential signal D+
DM	5	DIO	USB 2.0 differential signal D-
USB_REXT	10	AO	Connect 200 resister to ground
SSTXP	15	DO	USB 3.0 differential signal SSTX+
SSTXM	13	DO	USB 3.0 differential signal SSTX-
SSRXP	19	DI	USB 3.0 differential signal SSRX+
SSRXM	17	DI	USB 3.0 differential signal SSRX-
HDMI RX
HDMIRXCN	81	DI	HDMI RX Differential Clock Input Negative
HDMIRXCP	82	DI	HDMI RX Differential Clock Input Positive
HDMIRX0N	87	DI	HDMI RX Differential Data0 Input Negative
HDMIRX0P	88	DI	HDMI RX Differential Data0 Input Positive
HDMIRX1N	91	DI	HDMI RX Differential Data1 Input Negative
HDMIRX1P	92	DI	HDMI RX Differential Data1 Input Positive
HDMIRX2N	96	DI	HDMI RX Differential Data2 Input Negative
HDMIRX2P	97	DI	HDMI RX Differential Data2 Input Positive
HDMIRX_REXT	79	AO	Connect 1.6K resister to ground
HDMIRXHPD	49	DO	HDMI RX HPD signal output
HDMIRXDET	47	DI	HDMI RX 5V detection signal input
RXDDCSDA	48	DIO	HDMI RX DDC SDA
RXDDCSCL	46	DI	HDMI RX DDC SCL
HDMI TX
HDMITXCN	33	DO	HDMI TX Differential Clock Input Negative
HDMITXCP	34	DO	HDMI TX Differential Clock Input Positive
HDMITX0N	35	DO	HDMI TX Differential Data0 Input Negative
HDMITX0P	36	DO	HDMI TX Differential Data0 Input Positive
HDMITX1N	37	DO	HDMI TX Differential Data1 Input Negative
HDMITX1P	38	DO	HDMI TX Differential Data1 Input Positive
HDMITX2N	39	DO	HDMI TX Differential Data2 Input Negative
HDMITX2P	40	DO	HDMI TX Differential Data2 Input Positive
HDMITX_REXT	44	AO	Connect 1.6K resister to ground
HDMITXHPD	45	DI	HDMI TX hot plug signal output
TXDDCSDA	53	DIO	HDMI TX DDC SDA
TXDDCSCL	52	DO	HDMI TX DDC SCL
Digital Audio
I2SIN_WS	63	DIO	I2SIN_WS signal is output in master mode by default and can be configured by software to work in slave mode.
I2SIN_SCLK	64	DIO	I2SIN_SCLK signal is output in master mode by default and can be configured by software to work in slave mode.
I2SIN_SD0	65	DI	I2S input SD0 signal
I2SIN_SD1	62	DI	I2S input SD1 signal
I2S_MCLKOUT	66	DO	12.288MHz clock output
I2SOUT_WS	69	DIO	I2SOUT_WS signal is output in master mode by default and can be configured by software to work in slave mode.
I2SOUT_SCLK	70	DIO	I2SOUT_SCLK signal is output in master mode by default and can be configured by software to work in slave mode.
I2SOUT_SD0	72	DO	I2S output SD0 signal
I2SOUT_SD1	71	DO	I2S output SD1 signal
SPDIFOUT	73	DO	SPDIF format audio output
Test PIN
MCU_SEL	78	DI	Test PIN, floating by default
Crystal
XTIN	28	AI	24MHz passive crystal oscillator input
XTOUT	29	AO	24MHz passive crystal oscillator output
System Power & Ground
AVDD33_USB1~3	3,8,11	P	Analog Power (USB 3.3V)
AVDD33_1~4	80,86,90,95	P	Analog Power (3.3V)
DVDD33_1~7	2,20,51,55,61,74,100	P	Digital IO Power (3.3V)
AVDD25_1~4	27,30,43,83	P	Analog Power (2.5V)
AVDD11_USB1~3	9,14,18	P	Analog Power (USB 1.1V)
DVDD11_1~2	25,67	P	Digital Power (1.1V)
AVDD11_1~5	31,42,85,89,94	P	Analog Power (1.1V)
AVSS_1~10	4,6,12,16,26,32,41,84,93,98	G	Ground (Analog)
DVSS_1~9	1,21,24,50,54,56,68,75,99	G	Ground (Digital)

Abbreviation	Description
AI	Analog Input
AO	Analog Output
DI	Digital Input
DO	Digital Output
DIO	Digital Bi-direction
P	Power
G	Ground

Electrical Characteristics

Absolute Maximum Ratings

Parameter	Symbol	Value	Unit
Maximum Operating Voltage（AVDD33 / DVDD33 / DVDDIO）	VDD33	3.63	V
Maximum Operating Voltage（AVDD25）	VDD25	2.75	V
Maximum Operating Voltage（AVDD11 and DVDD11）	VDD11	1.21	V
Voltage On Any Pin With Respect to Ground	VI	-0.5 to DVDD33+0.5	V
Ambient Operating Temperature	TA	0 to 70	°C
Storage Temperature	Tsto	-65 to +150	°C
Allowable Junction Temperature	Tjmax	125	°C

Note1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameter	Symbol	Value	Unit
Junction-to-ambient Thermal Resistance (JEDEC 4-layer test board)	RθJA	30	°C/W
Junction-to-board Thermal Resistance	RθJB	8	°C/W
Junction-to-case Thermal Resistance	RθJC	12	°C/W

DC Characteristics

Parameter	MIN	Typical	MAX	Unit	Condition
VDD33	3.135	3.3	3.465	V	GND = 0V, TA = +25°C unless otherwise noted
VDD25	2.375	2.5	2.625	V	GND = 0V, TA = +25°C unless otherwise noted
VDD11	1.045	1.1	1.155	V	GND = 0V, TA = +25°C unless otherwise noted
Input Low Voltage	-0.3		0.8	V
Input High Voltage	2.0		3.6	V

Note1：VDD33 includes AVDD33_USB, DVDD33, AVDD33. VDD11 includes AVDD11_USB, DVDD11, AVDD11.

Power Consumption in Different Modes

Condition: GND = 0V, TA = +25°C.

Parameter	UVC ON, USB Input 1080P@60Hz, HDMI loop out 4K@30Hz	UVC OFF, HDMI no source	USB Suspend	Unit
VDD33	0.48	0.066	0.033	W
VDD25	0.12	0.012	0.004	W
VDD11	0.22	0.053	0.012	W

USB Video input fixed at 1920×1080@60Hz, YUV mode; HDMI loop out, the typical value of current in different resolution modes.

Condition: GND = 0V, TA = +25°C.

Parameter	4K@30Hz	1080P@60Hz	720P@60Hz	Unit
AVDD33	110	98	85	mA
DVDD33	35	35	26	mA
AVDD25	50	46	45	mA
AVDD11	115	87	75	mA
DVDD11	85	75	66	mA

Typical Application Circuit

Package Outline

Top Mark

Packing Information

Packing Information

	Packing carton dimension (Unit: mm)
Inner Carton	370(L)*155(W)*85(H)
Outer Carton	390(L)*330(W)*280(H)

Package Outline	Quantity per TRAY (Unit：PCS)	Quantity per inner carton (Unit：PCS)	Quantity per outer carton (Unit：PCS)	Inner Carton: Outer Carton
LQFP100（14X14）	90	900	5400	6:1

Carrier Tray Dimension

Reflow Specifications

Reflow Profile	Pb-Free Assembly
Preheating time (Tsmin to Tsmax)	60~120 seconds (150~200°C)
Liquidous Temperature (TL)	217°C
Peak Temperature (TP)	260°C (+5/-0°C)
Ramp-up Rate (TL to TP)	≤ 3.0°C/seconds
Time Maintained above TL	60~150 seconds
Time Within 5°C of Peak Temperature (above 255°C)	30~40 seconds
Ramp-up Rate (TP to TL)	≤ 6.0°C/seconds
Time 25°C to Peak Temperature	≤ 8 minutes

PCB Design Guidelines

Power and Ground

Power trace width should correspond to the current flowing through it. Refer to the current values in the Electrical Characteristics section. Recommended minimum trace widths:

Maximum Current (mA)	Recommended Trace Width (mil)
50	≥12
100	≥16
200	≥20
400	≥30

Note: Above values are based on 1oz copper.

• Decoupling capacitors must be placed close to the power pins of the chip

• Power must flow through capacitors before entering the chip pins

• Decoupling capacitor ground should be connected to power ground via nearby vias

Clock

• Place crystal oscillator close to the chip

• Keep routing as short as possible

• Ground pour around the crystal required

• No traces should be routed on the layer below the crystal to ensure complete ground plane

USB Signal Lines

USB differential pairs (SSTXP/M, SSRXP/M, and DP/M):

• Impedance matching required: 90±10% Ohms

• Differential pair routing should be as short as possible (no more than one via pair)

• Pair-to-pair skew: within 5mil

• Total length recommended: not exceeding 2000mil

• Ground pour required around differential pairs

• Maintain 3W rule (keep other signals at 3x trace width distance)

• No traces on layer below to ensure complete ground plane

HD Signal Lines

HD differential pairs:

• Impedance matching required: 100±10% Ohms

• Keep differential pair routing short (no more than two via pairs)

• Recommended intra-pair skew: within 5mil

• Recommended inter-group skew: within 15mil

• Ground pour required around differential pairs

• Maintain 3W rule (keep other signals at 3x trace width distance)

• No traces on layer below to ensure complete ground plane

• Place ESD devices, common-mode inductors, and series resistors close to HD connectors

• Component placement order: HD Connector → ESD Device → Common-mode Inductor → Series Resistor

Reference Design

Schematic

Block Diagram

MS2131 Main Chip

Audio Interface

Audio Mixing

Power Distribution

Bill of Materials (BOM)

Item #	Qty	Reference Designators	Part Number	Footprint	Description
1	44	C1,C2,C3,C6,C7,C9,C11,C13,C15,C17,C19,C21,C23,C27,C29,C32,C35,C37,C42,C56,C61,C63,C65,C66,C67,C68,C69,C70,C71,C72,C73,C74,C75,C76,C77,C78,C79,C80,C81,C82,C83,C84,C85,C128	100nF-16V	C0402	Decoupling capacitors
2	2	C4,C5	22pF-50V	C0402	Crystal load capacitors
3	16	C8,C10,C16,C28,C30,C31,C33,C34,C36,C55,C57,C58,C59,C60,C62,C64	10uF-16V	C0603	Bulk decoupling capacitors
4	12	C12,C14,C22,C24,C40,C45,C46,C51,C52,C53,C54,C143	1uF-16V	C0402	Low-ESR capacitors
5	3	C41,C43,C44	33nF-50V	C0603	Audio coupling capacitors
6	4	C47,C48,C49,C50	220pF-50V	C0402	High-frequency filtering
7	1	D2	1N5819HW-7-F	SOD-123	Schottky diode
8	1	D4	LED-Green	LED0603	Status indicator (green)
9	1	D5	LED-Red	LED0603	Status indicator (red)
10	1	EC1	220uF-16V	CAP-6.3X6.6-SMD	Electrolytic capacitor
11	6	FB1,FB2,FB3,FB4,FB5,FB6	120R-100MHz	L0603	Ferrite beads
12	7	FB7,FB8,FB9,FB10,FB12,FB13,FB14	90R-100MHz	L0603	Ferrite beads
13	2	J1,J2	U-C-19DD-W-1	HDMI-19P-TH	HDMI connectors (input/output)
14	3	J3,J4,J5	PJ-342	PJ-342	3.5mm audio jacks
15	1	J6	USB3.0 Female	USB-AF-W-3.0	USB 3.0 type-A connector
16	1	L2	2.2uH-1.2A	LP-2.0X1.6	Inductor
17	6	M1,M2,M3,M4,M5,M6	MARK	MARK	Board markings/test points
18	2	R1,R7	1.6K-1%	R0402	Impedance terminators (HD)
19	1	R2	200R-1%	R0402	USB terminator
20	2	R3,R4	47K-5%	R0402	Pull-up resistors
21	2	R5,R6	1K-1%	R0402	Current limit resistors
22	1	R8	1M-5%	R0402	High-impedance resistor
23	9	R9,R10,R11,R23,R25,R27,R28,R86,R87	1K-5%	R0402	Pull-up/pull-down resistors
24	4	R12,R13,R21,R33	2K-1%	R0402	Signal resistors
25	7	R14,R39,R78,R79,R80,R84,R85	NC	R0402	No-connect positions
26	8	R15,R16,R18,R73,R74,R76,R82,R88	10K-1%	R0402	Pull-up resistors
27	1	R17	10K-1%/NC	R0402	Configurable resistor
28	2	R20,R75	0R-1%	R0402	Jumper resistors
29	1	R22	49.9R-1%	R0402	Impedance matching
30	1	R36	90.9K-1%	R0402	Precision resistor
31	1	R37	100K-1%	R0402	Precision resistor
32	1	U1	ULC0544P10	DFN2510-10	ESD protection (USB)
33	1	U2	PRTR5V0U2X	SOT143B	ESD protection (HDMI)
34	1	U3	MS2131	LQFP100-14X14X05P	Main chip
35	4	U4,U5,U7,U8	RClamp0524P	SPL2510P8	ESD protection (HDMI)
36	1	U6	W25Q16DVSNIG	SOIC8-1.27-150MIL	SPI Flash (16Mb)
37	1	U9	ES7240S	TSSOP16-0.65-6.0	I2S audio interface
38	1	U10	ES8218E	QFN20-3X3X04P	Audio codec
39	2	U11,U12	MS7124	SOIC8-1.27-150MIL	Audio amplifier
40	2	U13,U14	CS4344/NC	TSSOP10-0.5-4.2	DAC (optional)
41	1	U15	SGM2549	SOT-23-6	High-side switch
42	1	U16	MS1117-3.3V	SOT-223	LDO regulator (3.3V)
43	1	U17	AMS1117-2.5V	SOT-223	LDO regulator (2.5V)
44	1	U18	MS1006-ADJ	SOT-23-5	Adjustable regulator
45	1	U19	24.0MHz	XTAL-3225	System clock oscillator

Component Placement

Top Placement

Bottom Placement

Key Features

• USB Interface: USB 3.0 female connector for high-speed data transfer

• HDMI I/O: One HDMI input and one HDMI output for video capture and passthrough

• Audio I/O: 3.5mm connectors for microphone input and audio outputs (headphone/speaker)

• Audio Mixing: On-board mixing of multiple audio sources via ES8218E codec

• Power Supply: Multiple voltage regulators providing 3.3V, 2.5V, and 1.1V rails

• ESD Protection: Multiple ESD protection devices for all external interfaces

• Storage: 16Mb SPI flash for firmware storage

Connectors

Connector	Type	Function
J1	HDMI-19P	HDMI Input
J2	HDMI-19P	HDMI Output
J3	3.5mm	Microphone Input
J4	3.5mm	Headphone Output
J5	3.5mm	Speaker Output
J6	USB 3.0-A	USB 3.0 Data/Power

Firmware Layout

MS2130 MS2131

ROM Address	Flash Address	Length	User Data	data type
0x00F800	0x00F830	0x100	edid	uint8 array[256]
0x00F900	0x00F930	0x120	hdcpUserKey	uint8 array[288]
0x00FA20	0x00FA50	0x020	ultrasemi	uchar array[32]
0x00FA40	0x00FA70	0x020	ultrasemi_version	uchar array[32]
0x00FA60	0x00FA90	0x020	ultrasemi_magic	uint8 array[32]
0x00FA80	0x00FAB0	0x020	ManufacturerString	user_string_t
0x00FAA0	0x00FAD0	0x020	ProduceString	user_string_t
0x00FAC0	0x00FAF0	0x020	U2ProduceString	user_string_t
0x00FAE0	0x00FB10	0x020	AudioString	user_string_t
0x00FB00	0x00FB30	0x020	U2AudioString	user_string_t
0x00FB20	0x00FB50	0x020	SerialnumString	user_string_t
0x00FB40	0x00FB70	0x020	U2SerialnumString	user_string_t
0x00FB60	0x00FB90	0x020	BCSH	user_bcsh_t
0x00FB80	0x00FBB0	0x020	AudioRoute	audio_route_t

user_string_t

• [Offset 0] length : uint8

• 2 ~ 31

• [Offset 1:31] char array : uchar

user_bcsh_t

Index	data type	data name	—
0	UINT8	bcsh_en	0x01: User BCSH data Enable other: User BCSH data Disable
1	INT8	b	-127 ~ 128
2	UINT8	c	0 ~ 255
3	UINT8	s	0 ~ 255
3	INT8	h	-127 ~ 128

audio_route_t

• [Offset 0] sample_rate : UINT8

• 0 : AUDIO_SR_48000

• 1 : AUDIO_SR_96000

• other : Not used

• [Offset 1] i2s_in_mode : UINT8

• 0 : slave

• 1 : master

• other : Not used

• [Offset 2] mix3_mode : UINT8

• 1 : HDMI RX

• 2 : I2S1 IN

• 3 : I2S1 IN & HDMI RX

• 4 : I2S2

• 5 : I2S2 IN & HDMI RX

• 6 : I2S1 IN & I2S2 IN

• 7 : I2S1 IN & I2S2 IN & HDMI RX

• other : Not used

• [Offset 3] i2s1_mode : UINT8

• 9 : HDMI RX

• 10 : MIX3 & USB OUT

• 11 : MIX3

• 12 : USB OUT

• other : Not used

• [Offset 4] usb_out_mute : UINT8

• 0 : unmute

• 1 : mute

• other : Not used

• [Offset 5] lk621_en : UINT8

• 0x00 : none

• 0x01 : config lk621 @0x26

• 0x02 : config lk621 @0x20

• 0x03 : config lk621 both

• other : Not used

HIDCMD

reserved 0x10~0x3F, 0xA0~0xFF

	B0	B1	B2	B3	B4	B5	B6	B7
cmd name	cmd code
SFR RD	C5	ADDR
SFR WR	C6	ADDR	DATA
IDATA RD	B5	00	ADDR
IDATA WR	B6	00	ADDR	DATA
IDATA RD	B5	ADDR_H	ADDR_L
IDATA WR	B6	ADDR_H	ADDR_L	DATA
FLASH RD	F7	01	00	PAGE_ADDR_H	PAGE_ADDR_L	LEN_H	LEN_L	00
FLASH RD	F7	00	00	PAGE_ADDR_H	PAGE_ADDR_L	ADDR_H	ADDR_L	00
FLASH WR	F8	01	00	00	00	PAGE_ADDR_H	PAGE_ADDR_L	00
FLASH WR	F8	00	D0	D1	D2	D3	D4	D5

MS2130 MS2131 MS2109 color and contrast

	MS2130	MS2130 BCSH	MS2109
Brightness	-11	0	?
Contrast	148	128	?
Saturation	180	128	?
Hue	0	0	?

sproxy

sproxy receives a bytestream on stdin in a ring-buffer. As configured, it provides the following tcp endpoints :

• tcp://0.0.0.0:8900: video stream from the current point onward. To access the video stream as it’s being pushed at the moment.

• tcp://0.0.0.0:8901: video stream with half of the current buffer. Useful for debugging. The smaller buffer displays the stream more quickly. Keyframes appear faster.

Sproxy allows multiple clients realtime access to a MPEG-TS encapsulated video (H.264, AAC) with zero setup. MPEG-TS is the most flexible protocol for this. A client can start reading wherever it wants in an MPEG-TS stream. The encapsulation is self-synchronizing.

sproxy succeeded multicast UDP over the network. That gave hard to debug problems with even moderate packet loss.

contact

• matrix://#videobox-support:fosdem.org

• video@fosdem.org

notes

• video-status: reads ms213x-status and more

• ms213x-status, ms213x-cli: not used ATM

• usb_reset: not actively needed with fazantix; keeping around just in case